RE: What is the limit? (was RE: multi-homing fixes)
|> From: mike harrison [mailto:meuon@highertech.net] |> Sent: Thursday, August 30, 2001 6:29 AM |> Maybe it's time to make some small point cooling systems for routers. |> When I was young electronics nut, we'd cool stereo amps this way |> to up the power output. As the last rack mount computer I installed |> had 6 cooling fans.. maybe it's time... see "Pelletier Effect" devices. Thermos made a portable ice-box, using that tech, for a while. It's all solid-state, no moving parts.
On Thu, 30 Aug 2001, Roeland Meyer wrote:
|> From: mike harrison [mailto:meuon@highertech.net] |> Sent: Thursday, August 30, 2001 6:29 AM
|> Maybe it's time to make some small point cooling systems for routers. |> When I was young electronics nut, we'd cool stereo amps this way |> to up the power output. As the last rack mount computer I installed |> had 6 cooling fans.. maybe it's time...
see "Pelletier Effect" devices. Thermos made a portable ice-box, using that tech, for a while. It's all solid-state, no moving parts.
But with low efficiency. Plus you still have to dump the thermal energy somewhere outside of the facility. I frankly don't see how this approach will buy you anything. David Leonard ShaysNet
On Thu, 30 Aug 2001, Roeland Meyer wrote:
see "Pelletier Effect" devices. Thermos made a portable ice-box, using that tech, for a while. It's all solid-state, no moving parts.
They are interesting, but what they are is merely heat pumps; you also need to carry the heat away with the flow of some material (eventualy to be pumped outside of the building). [Radiative cooling is not really applicable for the required rates of heat transfer; it'd require equipent to be hot way past the point of melting :)] --vadim
On Thu, 30 Aug 2001, Roeland Meyer wrote:
see "Pelletier Effect" devices. Thermos made a portable ice-box, using
tech, for a while. It's all solid-state, no moving parts. They are interesting, but what they are is merely heat pumps; you also need to carry the heat away with the flow of some material (eventualy to be pumped outside of the building). [Radiative cooling is not really applicable for the required rates of heat transfer; it'd require equipent to be hot way past the point of melting :)] Useful for a hybrid approach though - the big problem with liquid cooling is
"Vadim Antonov" <avg@exigengroup.com> wrote: that that the fluid and/or any condensed air vapour gets to flow inside a case with (at least theoretically) swappable parts; difficult to arrange that nothing requires either disconnecting and draining, or risks puncturing a fluid carrier. By using purely solid-state components (and some sort of thermal carrier paste) you could arrange for even hot-swappable (not an intentional pun BTW) components to be able to pump their heat to a thermal element on the outside of the case, which in turn is threaded with coolant pipes for a fluid-based system to expel heat to the outside of the building.
participants (4)
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David Howe -
M. David Leonard -
Roeland Meyer -
Vadim Antonov