Thank you for calling out the HMC point. I think that alone is worth retiring the platforms that were built around it.
The number of issues related the the HMC memory drivers were out of hand early on, and lingered long past the growing pains phase.
I’m sure in the big picture, supply chain / manufacturing constraints accelerated this, but part of me is happy to see HMC based stuff go.
On Tue, Jun 14, 2022 at 12:05 Saku Ytti <
saku@ytti.fi> wrote:
On Tue, 14 Jun 2022 at 18:56, Raymond Burkholder <ray@oneunified.net> wrote:
> Could you help me with HMC, BOM, YT?
Hybrid Memory Cube, type of stacked DRAM, with shorter distance due to
stack. HMC was early contender and for some applications superior, but
HBM ended up winning the fight.
YT is the latest Trio generation, if it is acronym, I have no idea
what it is from. The EOL is about EA Trio, I believe that is from
EAgle.
> BOM means to me BillOfMaterials, but I'm not sure I have that correct.
Correct.
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++ytti